Highcon announced today the launch of the latest in the Highcon Euclid series, the Highcon Euclid IIIC. This latest machine extends the range of the 3rd generation Highcon Euclid cutting and creasing machines into the world of corrugated and fluted substrates from 1 mm up to 3mm/ 40-120pt.
Electronics For Imaging, Inc. (Nasdaq:EFII) has expanded the speaker lineup for its users' conference, EFI™ Connect 2018 (Jan. 23-26 at Wynn Las Vegas). On January 23, EFI CEO Guy Gecht will moderate a pair of fireside chat keynotes with two innovative print and packaging industry executives: Eric Bacourt, CEO of Hinojosa Packaging Solutions and Mal McGowan, CEO of McGowans Print. The executives are the very first users of EFI's groundbreaking single-pass LED inkjet corrugated board digital press, the EFI Nozomi C18000.
DS Smith, Europe’s leading packaging strategist, is currently installing the second HP T1100S machine at DS Smith in the Germany & Switzerland region, in partnership with HP.
HP have announced the first delivery of an HP PageWide C500 Press for digital mainstream corrugated direct-to-board printing to a customer site, as HP continues to expand its portfolio of innovative package printing solutions.